Apple is expected to launch its next-generation iPhone models. Each year, the company offers customers a host of technological improvements over its prior-generation iPhone models, including improved cameras, displays, wireless capability, and last, but certainly not least, substantial improvements in the applications processor that powers the phones.
The applications processor represents the "brain" of the entire smartphone. The camera, for example, wouldn't be able to take the pictures that it does without the specialized image processor built into the chip. The speed at which applications -- which range from web browsing to 3D games -- run depends on the performance of the CPU and graphics processor in the chip.
In addition to being able to perform the above tasks (and much more) quickly, the applications processor must perform these tasks efficiently since smartphones are expected to last an entire day without needing to be recharged.
The Investor cites a Korea Economic Daily report to claim that the iPhone 8 will have a 3D camera module in the front capable of facial recognition. These modules will be made by LG Innotek, the same company that was responsible for the iPhone 7 Plus dual camera module. “[LG Innotek’s] new facility investment worth KRW 269.7 billion ($238.50 million) that was announced on April 27 will be dedicated to Apple’s orders. The initial deal size is estimated at about 200 billion won,” the report states. KGI was the first to suggest this feature on the iPhone 8.
Separately, a new report from DigiTimes suggests that TSMC has started mass producing the new Apple A11 SoC. The company is set to be the sole supplier of these SoCs, without Samsung in the equation, which is expected to be included in all three new iPhone models tipped to arrive this fall.
The report confirms that TSMC faced initial yield issues, but it seems to have solved that now. “TSMC has begun 10nm chip production for Apple’s next-generation iPhone 8 series, the sources said. Production was once affected by issues involving stacking components in the backend integrated fan-out packaging process, but they have already been solved,” sources told DigiTimes.
The iPhone 8 is also expected to sport 3GB of RAM, vertical dual rear camera setup, bundled AirPods, wireless charging, waterproofing, and much more.
Features
● 5.1"-5.2" edge-to-edge OLED screen● Stainless steel chassis
● Curved glass back, Wireless charging
● Curved screen
● Dual lens camera
● 10nm "A11" processor
● Fast cable charging
● Physical Home button replaced with software
● Touch ID, FaceTime camera & speaker embedded into screen
● Rear Touch ID
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